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Attach-a-File Enhancements to Job Application System and HRMS
On May 4, 2009 the university will respond to a much-anticipated enhancement request to our online job application process. Attach-a-file functionality for classified and A&P job applicants will be released. With this new, more robust technology, job applicants will notice changes in the job application system and hiring managers will see changes to Recruiting Summaries in HRMS.
Attach-a-file Highlights for Job Applicants:
- Will allow job applicants to upload formatted resumes, letters of interest, and references.
- Will allow applicants to store up to 15 resumes, 15 letters of interest, and 5 reference documents, each with a file size of up to 1MB in a Document Management section (similar to current Resume Information section).
- Will continue to provide applicants with the option to enter resume information into a text box, should they choose not to upload formatted files. Additional materials, such as letter of interest and work references may also be created this way. Documents created in this manner will be converted to text (.txt) documents and will then appear in the Document Management section.
- Will allow applicants to apply for postings with existing resumes stored in the job application system prior to May 4; however, applicants will first need to convert these resumes using functionality provided in the job application system.
Attach-a-file Highlights for Hiring Managers:
- Will allow managers to access resumes, letters, and reference documents with ease through the Applicant Listing section of the Recruiting Summary.
- Will allow managers to request additional materials to be mailed, such as work samples and transcripts.
- Will offer assurance of document safety through up-to-date virus scanning at both the upload and download points.
- Will allow managers to access completed applicant pools immediately after closing postings (for those requiring only resumes, letters, and references), without the delay of waiting for mailed in materials.
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