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19 August 1997
Degree Offered
Master of Science in Engineering
Facilities that include state-of-the-art capability in computer-aided design and manufacturing are available in the Engineering-Science Building and the Engineering Teaching Center, along with teaching laboratories for robotics and computer vision and a variety of other equipment related to manufacturing systems engineering.
Also available in the Engineering-Science Building are extensive facilities for processing semiconductor materials, including optical lithography equipment, two ion implantation systems, various evaporation and sputter deposition metallization systems, etching nitrides in low-pressure and plasma-enhanced chemical vapor deposition systems, several rapid thermal processing systems, and numerous furnace tubes for annealing, oxidation, and diffusion. The processing facilities are supported by a four-thousand gallon per day deionized water system, clean room for lithography, numerous laminar flow and wet processing hoods, and an ultrahigh-purity gas delivery system. The Microelectronics and Engineering Research Building at the J. J. Pickle Research Campus provides additional facilities for research in microelectronics, materials science and engineering, and manufacturing systems engineering.
The manufacturing systems engineering program is multidisciplinary, with a faculty that includes members from several departments of the College of Engineering and the Graduate School of Business. The current research of this faculty includes such topics as computer vision applications in manufacturing automation, robotics applications, automated manufacturing equipment design, multivariable control theory, robust and optimal control, computer-aided design, instrumentation design, scheduling algorithms for manufacturing systems, production and inventory control, facilities design and operations, hierarchical optimization of production systems, reaction injection molding, polymer blends, membranes, chemical vapor deposition, plasma processing, process control, process modeling of integrated circuit fabrication processes, improved integrated circuit fabrication processes, and device optimization for integrated circuit manufacturability.
At the doctoral level, the Department of Electrical and Computer Engineering and the Department of Mechanical Engineering offer concentrations in manufacturing systems engineering.
To enter the graduate program in manufacturing systems engineering, a student should normally have an undergraduate degree in engineering or in one of the physical sciences. Standards for entrance into the program generally exceed the minimum standards established by the University; a subcommittee of the Graduate Studies Committee recommends admission to the program.
Degree Requirements
Students seeking the master's degree are expected to write a thesis or master's report. The thesis option requires thirty semester hours of coursework, of which six hours are earned in the thesis course. The report option requires thirty-three semester hours of coursework, of which three hours are earned in the report course. The option of a master's degree without a thesis or report is available by petition; this program requires thirty-six semester hours of coursework.
Curriculum
All students must complete the core courses listed below and the courses in one of the indicated option areas. With the approval of the chairman of the Graduate Studies Committee, other courses may be counted toward fulfillment of the option area requirement.
Core Courses
Electrical Engineering 390C, Statistical Methods in Engineering and Quality Assurance
Management 386 (Topic 2: Manufacturing Management)
Mechanical Engineering 392Q (Topic 3: Modeling and Analysis of Manufacturing Systems)
Option Areas
Integrated Circuit Manufacturing
Electrical Engineering 380N (Topic 7: Computer Control of Manufacturing Systems)
Electrical Engineering 396K (Topic 7: MOS Integrated Circuit Process Integration)
Electrical Engineering 396K (Topic 8: VLSI Fabrication Techniques)
Physics 389K, Quantum Mechanics
Physics 392K, Solid-State Physics
Advanced Electronics Packaging
Electrical Engineering 396K (Topic 7: MOS Integrated Circuit Process Integration)
Electrical Engineering 396K (Topic 8: VLSI Fabrication Techniques)
Mechanical Engineering 339, Heat Transfer, or Mechanical Engineering 381R (Topic 4: Fundamentals of Heat and Mass Transfer)
Manufacturing Systems Engineering 397K (Topic 1: Advanced Packaging Materials)
Manufacturing Systems Engineering 397K (Topic 2: Electromagnetics in Packaging)
Manufacturing Automation and Assembly
Electrical Engineering 380N (Topic 7: Computer Control of Manufacturing Systems)
Electrical Engineering 380N (Topic 9: Fundamentals of Robotics)
Electrical Engineering 384N (Topic 3: Electromechanical Sensors/Actuators) or Mechanical Engineering 384N (Topic 3: Electromechanical Sensors/Actuators)
Electrical Engineering 394 (Topic: Electrical Machines for Robotics/Control) or Mechanical Engineering 392Q (Topic 6: Mechatronics)
Advanced Materials Manufacturing
Chemical Engineering 381P, Advanced Analysis for Chemical Engineers, or a chemical engineering elective
Chemical Engineering 391, Elements of Modern Control Theory
Chemical Engineering 392, Polymer Science
Chemical Engineering 395C, Chemical Processes for Microelectronics
Chemical Engineering 395E, Polymer Science and Engineering Laboratory
Design for Manufacturing
Electrical Engineering 380N (Topic 7: Computer Control of Manufacturing Systems)
Mechanical Engineering 392G (Topic 2: Computational Geometry for Engineering Design) or Mechanical Engineering 392Q (Topic 1: Introduction to Manufacturing Systems)
Mechanical Engineering 392Q (Topic 2: Computer Fundamentals for Manufacturing Systems)
Mechanical Engineering 392Q (Topic 5: Manufacturing Processes: Unit Processes)
Mechanical Engineering 392Q (Topic 6: Mechatronics)
Master of Science in Engineering/Master of Business Administration
The objective of this joint program is to offer an opportunity for a well-rounded professional education in the design and management of manufacturing technology. For the manufacturing engineer, this program offers the opportunity to understand the labor and management issues in the design of the manufacturing complex. For the manager of manufacturing, it offers the opportunity to develop an appreciation of world-class manufacturing technology.
A student must complete a total of at least seventy-two semester hours, including a report in the College of Engineering. Areas of specialization include design for manufacturing, manufacturing automation and assembly, advanced electronics packaging, integrated circuits, and advanced materials manufacturing.
A student interested in the joint degree program should apply through the Graduate and International Admissions Center. He or she must be accepted by each individual program in order to be admitted to the joint program. Like all other graduate applicants, the student is responsible for submitting any additional information required by the Graduate Studies Committee for each program.
Campus address: Engineering Teaching Center (ETC) 5.218, Phone
(512)
471-7571, Fax (512) 471-8727
Mailing address: Graduate Program in Manufacturing Systems Engineering, Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712-1063
E-mail: mfg@uts.cc.utexas.edu
URL: http://www.me.utexas.edu/~bryant/mfg/
Chapter Four
Graduate Catalog
Contents
Chapter 1: Graduate Study
Chapter 2: Admission and Registration
Chapter 3: Degree Requirements
Chapter 4: Fields of Study
Chapter 5: Members of Graduate Studies Committees
Appendix: Course Abbreviations
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