Browse Research by Faculty Name
Filtered by Department: Mechanical Engineering
Click on a faculty member's name to view the full profile, including any posted projects.
Displaying 31 - 40 of 85 records.
|Haberman, Michael||Mechanical Engineering||Elastic and acoustic wave propagation in complex media, new transduction materials, nondestructive testing, and acoustic transducers; Modeling and characterization of composite materials and …|
|Hall, Matthew||Mechanical Engineering||-Internal combustion engines -Hazardous Waste Incineration -Combustion and Flow in Porous Media Dr. Hall specializes in combustion and optical diagnostics.|
|Hamilton, Mark||Mechanical Engineering||-Nonlinear Surface Waves -High-intensity Ultrasonics -Numerical Modeling of Finite Amplitude Sound Dr. Hamilton's expertise is in physical acoustics, particularly in the areas of …|
|Hasenbein, John||Mechanical Engineering||-Stochastic fluid networks and stochastic programming -Fluid holding cost algorithms, linear and nonlinear approximations -Game-theoretic queueing models and pricing -Scheduling multiclass networks …|
|Hebner, Robert||Mechanical Engineering||-Production of biofuels from algae -Improved wind power systems -Energy storage -Electrical breakdown -Green ships|
|Hidrovo Chavez, Carlos||Mechanical Engineering||-Multiscale and multiphase thermal fluids flows -Optical and non-invasive diagnostics tools -Micro/nanoengineered surfaces and interactions|
|Ho, Paul||Mechanical Engineering||-Electronic Packaging Materials and Processing -VLSI Interconnect Technology -Microelectronics Materials and Processing Dr. Ho is studying materials and processing for the development of wiring …|
|Howell, John||Mechanical Engineering||Developing solution techniques for radiative transfer in participating media (particularly the Monte Carlo method); solutions of highly non-linear combined mode heat transfer problems; inverse design …|
|Im, Jang-Hi||Mechanical Engineering||His current research areas at the University are in semiconductor packaging and reliability, 3D integration with through-silicon-vias (TSVs), electromigration of Pb-free solders, materials science of …|
|Iyoob, Ilyas||Mechanical Engineering||Cloud Computing, IT Supply Chain, Network Design, Reliability|